Design Technology Platform Roles (US/ Taiwan)
(1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG).
(2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc.
(3) Technology benchmarking for PPA evaluation of the advanced nodes.
(4) DTCO (Design & Technology Co-Optimization) pathfinding and development.
(1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support.
(2) Advanced technology design development flow development and technical support.
(3) Automation program development to support design kits and flow development productivity/quality.
(1)The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements.
(1) Pathfinding of library characterization for leading edge tech nodes.
(2) Support industrial standard library kits generation and QC.
(3) In-house library generation flow and/or utility development.
(4) RC parasitic extraction analysis and APR related analysis.
(1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications.
(2) RRAM/MRAM, emerging memory development.
(3) In memory computing research and development.
Job Qualifications
1. Master's degree or above in Electrical Engineering or Computer Engineering.
2. Thorough understanding of place and route flow.
3. Excellent interpersonal and communication skills.
4. Self-motivated and possess excellent team spirit.
-> Taiwan Opportunity: https://careers.tsmc.com/en_US/careers/JobDetail?jobId=16566&source=External%2BCareer%2BSite
-> US Opportunity: https://career10.successfactors.com/sfcareer/jobreqcareerpvt?jobId=7149&company=taiwansemiP1&st=B639B69FC06FD5FAE54A966FC714595ABD2DF76D
Research and Development Engineer Roles (US/ Taiwan)
(1) New material and new process pathfinding to enable new device architecture with integration.
(2) New tool pathfinding for new materials to enable the next nodes.
(3) Design, execute and analyze experiments to meet R&D engineering specifications.
(4) Process stability & manufacturability improvement for yield and reliability qualification.
(5) Process/tool transfer to development R&D or volume manufacturing (Fab).
(6) Highly motivated individuals with a strong technical background and teamwork skills.
(1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc.
(2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc.
(3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies.
(4) Customer design enablement: SPICE Modeling and IP qualifications.
(1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies.
(2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification.
(3) Transfer process and tool to high volume manufacturing fab.
Job Qualifications
1. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
2. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics.
3. Passionate about the development of world-leading technologies.
4. Skills in AI and programming are preferred.
-> Taiwan Opportunity: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=16359
-> US Opportunity: https://career10.successfactors.com/sfcareer/jobreqcareerpvt?jobId=7149&company=taiwansemiP1&st=B639B69FC06FD5FAE54A966FC714595ABD2DF76D
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan.